Asrock H810M-P Gen5. Processor manufacturer: Intel, Processor socket: LGA 1851 (Socket V1), Compatible processor series: Intel Core Ultra (Series 2). Supported memory types: DDR5-SDRAM, Maximum internal memory: 128 GB, Memory slots type: DIMM. Supported storage drive interfaces: SATA III, M.2, Supported storage drive types: HDD & SSD. LAN controller: Realtek RTL8111H. Component for: PC, Motherboard form factor: micro ATX, Motherboard chipset family: Intel
Tehniskā specifikācija
Mātes plates chipset
Intel H810
Audio mikroshēma
Realtek ALC897
Mātes plates formas faktors
mikro ATX
Audio izvades kanāli
7.1 kanāli
Mātesplates mikroshēmojuma saime
Intel
Atbalstītās Windows operētājsistēmas
Windows 11 x64
Procesora ligzda
LGA 1851 (Socket V1)
Savietojami procesori
Intel Core Ultra (Series 2)
SMO procesoru maksimālais skaits
1
Atbalstītās atmiņas veidi
DDR5-SDRAM
Atmiņas kanāli
Duālais kanāls
ECC savietojamība
Non-ECC
Maksimālā iekšējā atmiņa
128 GB
Atbalstītie atmiņas disku veidi
HDD & SSD
Atbalstītie glabāšanas diska interfeisi
SATA III,M.2
USB 3.2 Gen 1 (3.1 Gen 1) savienotāji
1
SATA III savienotāju skaits
4
Priekšējā paneļa audio savienotājs
Jā
CPU ventilatora savienojums
Jā
Procesora ventilatoru konektoru skaits
1
Komutatora ventilatoru skaits
1
EPS barošanas savienotājs (8-pin)
Jā
EPS barošanas konektoru skaits (8 kontakti)
1
RGB LED tapu savienotājs
Jā
RGM LED kontaktu turētāju skaits
2
Aizmugurējā paneļa I/O porti
USB 2.0 pieslēgvietu skaits
4
USB 3.2 Gen 1 (3.1 Gen 1) A tipa pieslēgvietu skaits
2
Ethernet LAN (RJ-45) pieslēgvietu skaits
1
HDMI pieslēgvietu skaits
1
Mikrofons, līnijas izeja
Jā
Ethernet/LAN savienojums
Jā
LAN kontrollers
Realtek RTL8111H
PCI Express x1 (Gen 4.x) ligzdas
1
PCI Express x16 (Gen 5.x) sloti
1
BIOS atmiņas izmērs
256 Mbit
ELKO Verified Logistics Data
ELKO Internal Logistics Data
Shipping Box Weight
9.9 kg
Shipping Box Height
28.5 cm
Shipping Box Depth
54.5 cm
Shipping Box Width
31.5 cm
Hyper M.2 Gen4 x4
Supports PCI Express 4.0 M.2 SSDs, it is capable of perform twice the speed compared to previous 3rd generation, giving a lightning fast data transferring experience.
Aluminum Heatsink
The first thing that catches the eye is the optimized Aluminum Heatsink Design. Heatsinks are crucial for efficient heat dissipation, especially during heavy workloads like gaming or productivity tasks. Motherboard that built with heatsinks can effectively manage thermal performance, hence ensure system stability and durability effortlessly.
POLYCHROME RGB
This motherboard features onboard RGB headers and addressable RGB headers that allow motherboard to be connected to compatible LED devices such as strip, CPU fans, coolers, chassis and so on. Users may also synchronize RGB LED devices across the Polychrome RGB Sync-certified accessories to create their own unique lighting effects.
SignalRGB
SignalRGB unifies your RGB devices, offering seamless customization, game-reactive effects, macro automation, and system monitoring. The official partnership empowers ASRock motherboards with advanced lighting control, enhances compatibility with a diverse range of RGB devices, and provides greater customization flexibility.
M.2 (KEY E) For WiFi
Besides the onboard LAN port, users may also choose wireless connections by M.2 (Key E) slot.
Dual Graphics Outputs
Complete with two types of most used connectors! Packed with a HDMI + DisplayPort combo, you have more graphics output options now.
Produktu pieejamība var atšķirties atkarībā no ELKO izplatīšanas reģiona.
