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MB B760 S1700 ATX/B760 GAMING PLUS WIFI DDR4 MSI

ELKO kods
1433359
MSI B760 GAMING PLUS WIFI DDR4. Processor manufacturer: Intel, Processor socket: LGA 1700, Compatible processor series: Intel® Celeron®, Intel® Pentium® Gold. Supported memory types: DDR4-SDRAM, Maximum internal memory: 128 GB, Memory slots type: DIMM. Supported storage drive interfaces: M.2, SATA, RAID levels: 0, 1, 5, 10. Ethernet interface type: 2.5 Gigabit Ethernet, LAN controller: Dragon RTL8125BG, Top Wi-Fi standard: Wi-Fi 6 (802.11ax). Component for: PC, Motherboard form factor: ATX, Motherboard chipset family: Intel
Tehniskā specifikācija
Model
B760 GAMING PLUS WIFI DDR4
Īpašības
Mātes plates chipset
Intel B760
Audio mikroshēma
Realtek ALC897
Komponente
PC (dators)
Mātes plates formas faktors
ATX
Audio izvades kanāli
7.1 kanāli
Mātesplates mikroshēmojuma saime
Intel
Atbalstītās Windows operētājsistēmas
Windows 10 x64/Windows 11 x64
Procesors
Procesora ražotājs
Intel
Procesora ligzda
LGA 1700
Savietojami procesori
Intel® Celeron®/Intel® Pentium® Gold
Atbalstītās procesoru ligzdas
LGA 1700
Procesora atbalstīta maksimālā iekšējā atmiņa
128 GB
Atmiņa
Atbalstītās atmiņas veidi
DDR4-SDRAM
Atmiņas slotu skaits
4
Atmiņas slotu tips
DIMM
Atmiņas kanāli
Duālais kanāls
ECC savietojamība
Non-ECC
Atbalstītie atmiņas pulksteņa ātrumi
2133/2400/2666/2933/3200/3333/3400/3466/3600/3733/3800/4000/4200/4266/4400/4600/4800/5000/5066/5200/5333 MHz
Maksimālā iekšējā atmiņa
128 GB
Uzglabāšanas kontrolleri
Atbalstītie glabāšanas diska interfeisi
M.2,SATA
Atbalstāmo cieto disku skaits
4
Atbalstītais uzglabāšanas diskdziņu skaits
6
Atbalsta RAID
Jā
RAID līmeņi
0/1/10/5
Iekšējie I/O
USB 2.0 savienotāji
4
USB 3.2 Gen 1 (3.1 Gen 1) savienotāji
3
SATA III savienotāju skaits
4
SATA savienotāju kopskaits
4
S/PDIF out savienotājs
Jā
TPM savienotājs
Jā
RGB LED tapu savienotājs
Jā
Aizmugurējā paneļa I/O porti
USB 2.0 pieslēgvietu skaits
4
USB 3.2 Gen 2 (3.1 Gen 2) A tipa pieslēgvietu skaits
2
USB 3.2 Gen 2 (3.1 Gen 2) C tipa pieslēgvietu skaits
1
Ethernet LAN (RJ-45) pieslēgvietu skaits
1
HDMI pieslēgvietu skaits
1
HDMI versija
2.1
DisplayPorts daudzums
1
DisplayPort versija
1.4
S/PDIF out pieslēgvieta
Jā
Tīklošana
Ethernet/LAN savienojums
Jā
Ethernet interfeisa tips
2.5 Gigabit Ethernet
LAN kontrollers
Dragon RTL8125BG
Wi-Fi
Jā
Wi-Fi standarts
Wi-Fi 6 (802.11ax)
Wi-Fi standartu
802.11a/802.11b/802.11g/Wi-Fi 4 (802.11n)/Wi-Fi 5 (802.11ac)/Wi-Fi 6 (802.11ax)
Bluetooth
Jā
Bluetooth versija
5.3
Paplašināšanas sloti
PCI Express x1 sloti
3
PCI Express X1 (Gen 3.x) sloti
3
PCI Express x16 sloti
2
PCI Express x16 (Gen 4.x) ligzdas
2
M.2 (M) slotu skaits
2
BIOS
BIOS tips
UEFI AMI
BIOS atmiņas izmērs
256 Mbit
ACPI versija
6.4
Svars&dimensijas
Platums
243.84 mm
Dziļums
304.8 mm
ELKO Verified Logistics Data
Preces neto svars
1.2 kg
Vienības platums
6.6 cm
Vienības dziļums
27 cm
Vienības augstums
34.8 cm
ELKO Internal Logistics Data
Shipping Box Weight
16.16 kg
Shipping Box Height
37 cm
Shipping Box Depth
56 cm
Shipping Box Width
35 cm

B760 GAMING PLUS WIFI DDR4
The B760 GAMING PLUS WIFI DDR4 is crafted to offer extensive connectivity, versatile tools, and a convenient Wi-Fi solution for gamers seeking a comprehensive experience. Featuring 2.5G LAN, Wi-Fi 6E, DDR4 support, PCIe 4.0 capabilities, and dual M.2 connectors, it is optimized for Intel® Core 14th /13th /12th Gen processors.

Extended Heatsink
Extended Heatsink enlarges the surface of heat dissipation, ensuring even high-end processors to run in full speed.

Heavy Plated VRM Heatsink
The VRM heatsink covers the upper MOS and helps dissipate the heat.

M.2 Shield Frozr
Keeps M.2 SSDs safe while preventing throttling, making them run faster.

7W/mK Thermal Pad & Additional Choke Pad
High quality 7W/mK MOSFET thermal pads and extra choke thermal pads ensure all cores running in high performcance.

DIY 2.0 – INTEGRATING WITH THE SYSTEM ENVIRONMENT
Connect and synchronize with MSI coolers and cases with strategically positioned pin-header locations including a dedicated pump-fan header.

OPTIMIZED FOR WATER COOLING
Designed to support the most popular All-In-One & customized water cooling solutions on the market. A dedicated water pump PIN header supports up to 3 amp, giving you full control of the water pump speed. A clearly marked ‘keep-out-zone’ allows for easy and safe installation and a perfect fit.

LIGHTNING GEN 4 PCI-E
Doubling over the previous generation, the bandwidth of a x16 interface can reach 64GB/s.

REINFORCED,
HEAVY SOLDERED CONNECTIONS
Secure to the motherboard with extra solder points and support the weight of heavy graphics cards.
FAST AND FUTURE-READY STORAGE
B760 GAMING PLUS WIFI DDR4 motherboards support all the latest storage standards, which allows users to connect any ultra-fast storage device. Start games faster, load levels faster and have a real advantage over your enemies.

  • Support Intel® Core™ 14th/ 13th/ 12th Gen Processors, Intel® Pentium® Gold and Celeron® Processors for LGA 1700 socket
  • Supports DDR4 Memory, up to 5333+(OC) MHz
  • Enhanced Power Design: 12+1 Duet Rail Power System with P-PAK, 8-pin + 4-pin CPU power connectors, Core Boost, Memory Boost
  • Premium Thermal Solution: Extended Heatsink, MOSFET thermal pads rated for 7W/mK, additional choke thermal pads are built for high performance system and non-stop gaming experience
  • Lightning Fast Game experience: PCIe 4.0 slot, Lightning Gen 4 x4 M.2 with M.2 Shield Frozr, USB 3.2 Gen 2 10G
  • 2.5G LAN with Wi-Fi 6E Solution: Upgraded network solution for professional and multimedia use. Delivers a secure, stable and fast network connection
  • High Quality PCB: 6-layer PCB made by 2oz thickened copper
  • Audio Boost: Reward your ears with studio grade sound quality for the most immersive gaming experience

Produktu pieejamība var atšķirties atkarībā no ELKO izplatīšanas reģiona.